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HP HP3-X05 Exam Syllabus Topics:
| Section | Weight | Objectives |
|---|---|---|
| Topic 1: Troubleshooting & Diagnostics | 25% | - Component-level fault isolation - Power-on and boot issues - Hardware error codes and symptoms |
| Topic 2: Product Overview & Specifications | 20% | - HP Mini 1000/110/210 series features - Hardware architecture and components - Technical specifications and variants |
| Topic 3: Service Best Practices | 10% | - ESD safety and handling procedures - Part identification and ordering |
| Topic 4: Firmware & Software Support | 10% | - Recovery procedures and OS restoration - BIOS updates and configuration |
| Topic 5: Removal & Replacement Procedures | 35% | - Disassembly and reassembly guidelines - System board, memory, and storage replacement - Display, keyboard, and internal components service |
